- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
Patent holdings for IPC class H01L 23/40
Total number of patents in this class: 1771
10-year publication summary
127
|
156
|
138
|
197
|
216
|
185
|
157
|
130
|
131
|
48
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Mitsubishi Electric Corporation | 43934 |
123 |
Intel Corporation | 45621 |
84 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
81 |
Fuji Electric Co., Ltd. | 4750 |
67 |
Denso Corporation | 23338 |
63 |
International Business Machines Corporation | 60644 |
38 |
Mitsubishi Materials Corporation | 2378 |
36 |
Infineon Technologies AG | 8189 |
31 |
Apple Inc. | 50209 |
25 |
Siemens AG | 24990 |
25 |
Huawei Technologies Co., Ltd. | 100781 |
25 |
Samsung Electronics Co., Ltd. | 131630 |
23 |
Semiconductor Components Industries, L.L.C. | 5345 |
23 |
Micron Technology, Inc. | 24960 |
21 |
Rohm Co., Ltd. | 5843 |
21 |
Sumitomo Electric Industries, Ltd. | 14131 |
16 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
16 |
Toyota Motor Corporation | 28582 |
15 |
Fujitsu Limited | 19265 |
14 |
Kyocera Corporation | 12735 |
14 |
Other owners | 1010 |